• Reduce Nonconformity
  • Increase Customer Satisfaction
  • ​Increase Profitability
  • ​On-Time-Delivery

Stocking Distributor of Board Level Components & Peripherals

Beltway Electronics

Quality Policy

​Beltway Electronics is committed to satisfying our customers through the maintenance and continuous improvement of our Quality Management System.

Quality Objectives

We are compliant with the following standards:


An international standard that defines an acceptable quality management system for a company. It supplies necessary detail to provide direction about what to include in their processes.


Quality Management Systems – Aerospace Requirements for Distributors.


An international standard that defines the protection of electrical and electronic parts, assemblies, and equipment.​


Fraudulent/Counterfeit Electronics Parts Avoidance Detection, Mitigation, and Disposition Distributors Standard.

We have the ability to perform the following testing procedures:


Functional testing shall be available to all of our customers. This testing process will ensure that the product will function as described after being installed into the customer’s system.


The system will show the engineer if the internals are the same from one component to the next. It is also used to determine the exact location of the die for easier decapping. This test is designed to locate any components that are different from the first component observed. It will determine if a counterfeiter has placed good components at the front of the tape and then changed to an altered version later in the tape.


This test is a very complex system that is used to evaluate the topography of a component and to make a determination about the authenticity of the surface.


The surface decapping systems we use are employed to remove the material surrounding the internal circuitry of a component. This allows engineering to determine whether the die is the correct part number and revision level for that component.


The Solderability Test System is used to determine whether the component’s connection points will allow the proper solder adhesion in the appropriate amount of time per the component’s specification data sheet.


Used to test and verify whether the component has any of the (6) elements banned by the RoHS directive. Its primary use, however, is to determine if the leads are solder-based or lead-free. Some customers require the leads be lead rather than lead-free. The XRF System will analyze the leads, make a determination, and provide a report of their authenticity.


As part of the in-depth incoming inspection procedure, components shall have the part number, ink stamping, and the component surface validated to ensure authenticity.